Junction Temperature

Steady-state junction temperature and heat-sink sizing for power semiconductors via the θjc → θcs → θsa thermal-resistance chain

Operating Point

W
°C
°C

Package & Sink

K/W
K/W

Thermal Interface

W/(m·K)
mm²
K/W
Within Rating
0.0
Junction Temperature (°C)?
0.0
Thermal Margin (%)?
0.00
Required Sink Resistance (K/W)?
ambientdiecaseTIMPTj 0.0°CTc 0.0°CTs 0.0°CTa 25.0°C

Results

Junction Temperature(Tj)?
0.0°C
Case Temperature(Tc)
0.0°C
Sink Temperature(Ts)
0.0°C
Total Thermal Resistance(θtotal)
0.000K/W
Case-to-Sink Resistance(θcs)
0.000K/W
Required Sink Resistance(θsa_req)?
0.00K/W
Thermal Margin(margin)?
0.0%
Headroom Below Derating(ΔT_derate)?
0.0°C
Design looks good

Junction Temp vs Power

Tj_maxη·Tj_max
P = 5.0 WTj = 84.2 °CTj_max = 150 °C

Created by Catlynn Nguyen & Jie Chai · 2026